5019313070
Molex
Product No:
5019313070
Manufacturer:
Package:
-
Batch:
-
Datasheet:
Description:
CONN RCPT 30POS 0.049 GOLD SMD
Quantity:
Delivery:
Payment:
In Stock : 8471 
Minimum: 1 Multiples: 1
Qty
Unit Price
Ext Price
1
$3.4675
$3.4675
10
$3.0533
$30.533
100
$2.428675
$242.8675
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Product Information
Parameter Info
User Guide
| Mfr | Molex |
| Style | Board to Cable/Wire |
| Series | Duo-Clasp 501931 |
| Package | Tape & Reel (TR) |
| Features | Pick and Place, Solder Retention |
| Termination | Solder |
| Applications | General Purpose |
| Contact Type | Forked |
| Contact Shape | - |
| Mounting Type | Surface Mount |
| Connector Type | Receptacle |
| Fastening Type | Detent Lock |
| Number of Rows | 2 |
| Pitch - Mating | 0.049" (1.25mm) |
| Product Status | Active |
| Voltage Rating | 50V |
| Contact Material | Copper Alloy |
| Insulation Color | Natural |
| Insulation Height | 0.346" (8.80mm) |
| Ingress Protection | - |
| Base Product Number | 501931 |
| Insulation Material | Polyamide (PA), Nylon |
| Number of Positions | 30 |
| Row Spacing - Mating | - |
| Contact Finish - Post | Tin |
| Contact Length - Post | - |
| Current Rating (Amps) | 1A |
| Operating Temperature | -25°C ~ 85°C |
| Mated Stacking Heights | - |
| Contact Finish - Mating | Gold |
| Number of Positions Loaded | All |
| Material Flammability Rating | UL94 V-0 |
| Contact Finish Thickness - Post | 39.4µin (1.00µm) |
| Contact Finish Thickness - Mating | 3.90µin (0.099µm) |
2000+Daily average RFQ Volume
30,000,000Standard Product Unit
2800+Worldwide Manufacturers
15,000 ㎡In-stock Warehouse
